The receivers are available in either: 1280 points in 160 point increments and 1700 points in 170 point increments.
Agilent 3070 ict test systems series#
H+W Test Products developed a series of receivers that utilize a modular, spring-loaded interface that allows the user to purchase only the number of interface points required for their present need. Threaded Nylon pressure fingers are included with each unit. Our second, is a low cost adjustable in the X, Y & Z axis, series that is perfect for vacuum, non-vacuum, mechanical and Opens Testing applications. This line of overclamps feature precision machined aluminum and stainless steel parts for superior strength and smooth operation. Our first series, the LINEAR TOUCH™, has an unrestricted open design for Push Pin placements in the X, Y axis & has linear Z axis motion, which eliminates wiping action. H+W Test Products has developed two (2) different series of fixture overclamps. Overclamps/Receivers/Spare Parts/Accessories/Board Handler Fixtures All mechanical test fixtures are available with ESD impregnated Lexan top plates, ESD impregnated G10/FR4 probe plates and ESD Delrin tipped pressure fingers. These fixtures are designed for testing low volume runs of printed circuit boards (PCB) test fixtures or prototype applications.
H+W Test Products has developed a series of inexpensive mechanical test fixtures. H+W Test Products also manufactures our own line of deep and sloped pan fixtures for general purpose/system non-specific pcb test applications.Īll H+W vacuum fixtures are manufactured using our patented REBOUNDER® technology and use only high quality fine weave G10/FR4 probe plates and impregnated ESD G10/FR4 top plates. H+W Test Products manufactures test fixture products for in-circuit, functional and combinational testers for users of automated test systems (ATE) such as Aeroflex, Keysight (Agilent) (HP), Checksum, Factron, Teradyne (GenRad), Test Research (TRI) and Testronics. The CheckSum Analyst ems combines comprehensive manufacturing process testing with TestJet Technology for low cost in circuit test of today’s complex boards.Vacuum, Non-Vacuum & Mechanical Test Fixtures for Printed Circuit Boards
Agilent 3070 ict test systems plus#
In Circuit Test (ICT) plus Part ProgrammingĬapable. Check them out and see how CheckSum can reduce testing cost and help increase manufacturing margins. That’s where the CheckSum Analyst Low Cost In-Circuit Testers come in. The good news about new board and parts technologies and the resulting Fault Spectrum Shift is that much lower cost ICT systems will do the job as effectively as old, expensive ones. Keep in mind that no matter how low the purchase price, “big iron” ICT still has high overhead costs from complex test fixtures and lengthy test programming processes-even when built-in capabilities like vector testing are not even used. Seeking a lower-cost ICT strategy demands that you examine not only the purchase price of the tester, but also ongoing operating and applications cost, such as fixturing, programming, and support. In a fixed budget environment every dollar you spend unnecessarily on ICT means a dollar that you can’t invest in new inspection technologies like AOI and AXI. Today’s smaller test departments and constrained budgets demand lower ICT costs. And newer assembly defect classes such as cold solder joints and skewed components are simply invisible to in-circuit testers and must be diagnosed by other means such as automated imaging (AOI, AXI).Įvolving technologies aren’t the only reason you should reexamine your ICT strategy and equipment. In fact, traditional digital vector test is ineffective on today’s complex, highly integrated devices. Capabilities found on these testers such as high-accuracy analog and digital vector test are increasingly superfluous because they are designed to test for faults that rarely-if ever-occur on today’s boards. The Fault Spectrum Shift has basically negated the cost effectiveness of traditional ICT testers such as the Agilent 3070-series and Teradyne TestStation. Traditional ICT capabilities are increasingly expensive-and unnecessary And as long as there are circuit boards, ICT will continue to be the key to effective manufacturing process test.īut evolving technology requires a complete rethinking of in-circuit test strategy-and about the in-circuit tester itself. In-circuit test (ICT) is still the most cost effective means to identify component faults and manufacturing process defects. Assembly and soldering defects still occur. Bad parts still find their way onto boards. For boards ranging from simple to complex, the test and inspection process remains as critical as ever. New Circuit Board Technology Requires New Strategic ThinkingĬircuit board technology evolves rapidly: more highly integrated devices, increasing package pin counts, denser placement of smaller components and thinner circuit traces.
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